Description

Previous methods to produce microvias are based on complex technologies such as laser, plasma or photo imaging. Chemical Via is a new chemical method to make microvias for high density printed multilayer circuits. Microvias are used to interconnect adjacent layers and consist of a small diameter hole (usually 70µm) with a thin metallic deposit covering their cylindrical walls to ensure the local conductivity between the bottom and top layers. Microvias of any shapes and dimensions are made possible at a low production costs.
The technology was used by CERN PCB manufacturing workshop for the production of PCboards for HEP needs.

Areas of expertise

Microelectronics; Materials sciences.

Applications

• Microelectronics
• PCBs industry

Innovative features

• Easy elimination of elements (e.g. glue) by dissolving using a chemical process.
• Kapton carving by using a sequence of simple chemical baths.

Specifications

• Etching time (9-18 min)
• An isotropic Etching technique (Deep reactive ion etching) is used
• Minimum via diameter (40µm)

Advantages

• Vias of several possible dimensions from microns to centimeters
• Initial fabrication investment to use method is low
• Vias of any shape (circle, star, square, etc) can be produced and standardized
• Process or method compatible with all standard PC assembly lines

Intellectual Porperty status

Ready for licensing. Patented technology, WO03055288.